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The Alcatel 601 E is an automatic etching machine used exclusively
for the plasma etching of silicon and related materials. It can
work with wafers of between 100mm and 200mm in diameter, at room
temperature (between -30 C and +30 C) or low temperature (<100
C). The Alcatel 601 E is a manually loaded single plate type machine
and is particularly well suited to R/D activities.
This machine consists of 5 parts: a process module ensuring the
vacuum process of wafers, a transfer module allowing to load and
unload wafers automatically while maintaining the process module
under vacuum, a control module ensuring the user interface and
the management of the machine, a gas module ensuring the supply
of the machine with process gas and a utilities module allowing
the utilities connections (water, air, dry nitrogen, helium, liquid
nitrogen bottle or chiller, external rough pumps) as well as electrical
connections. |
