Scope of Advanced Materials in Semiconductor Manufacturing
Location:258 Fitzpatrick Hall
Fabricating semiconductor devices involves four basic processing steps: deposition of key active materials onto the underlying silicon wafer; selective removal of unwanted materials; patterning or lithography to alter the shape of the deposited materials (to create the desired connections and circuits); and modification of electrical properties using ion implantation followed by activation and other techniques. Semiconductor manufacturing therefore requires advanced materials at different steps. In this talk, I’ll introduce the semiconductor materials space where Air Products operates. I also plan to introduce SEMATECH and its programs in developing advanced semiconductor manufacturing processes. Following the above introductory session, I plan to discuss wafer cleaning during chip manufacturing. Every wafer processing step is a potential source of contamination, which may lead to defect formation and device failure. Cleaning of wafers must take place after each processing step and before each high-temperature operation, making it the most frequently repeated step in IC manufacturing. This surface preparation includes cleaning before and after etches, oxidation, deposition, photo-resist stripping, and post-CMP residue removal. As part of this, I’ll show some of our own efforts in photo resist/etch residue removing and post CMP cleaning, using proprietary formulations.
Gautam Banerjee, Ph.D., MBA
Strategic Partnerships Manager & Assignee at SEMATECH; Air Products and Chemicals, Inc., Allentown, PA
Dr. Gautam Banerjee is currently the Strategic Partnerships Manager at Air Products – Electronics Divsion and an assignee at SEMATECH, Center for Nano Science and Engineering, SUNY-Albany. He is responsible for Strategic Partnerships with all the chip manufacturing companies who are members of the SEMATECH/CNSE consortia, in the area of various dielectric and metal precursors, cleaning solutions and planarization slurries needed for semiconductor chip manufacturing. Until Sept 2012, he was the Global Applications Manager for the electronics formulated products, responsible for new product development, market introduction and application support globally, for the semiconductor wafer cleaning formulations offered by Air Products Electronics Division. Prior to this position, he has worked as both R&D manager and Global Business Manager of wafer planarization slurries and cleaning products for Air Products. In his professional role, he travels globally to every semiconductor manufacturing facility in the world and discusses manufacturing process development issues and future needs with engineers/scientists working in these technologies. Before Air Products, Dr. Banerjee worked as the Chief Scientist in DuPont Air Products Nano Materials, as the R&D manager in Ashland Specialty Chemical Company in Dublin, OH and as the senior scientist/integration manager at Rohm and Haas Electronic Materials, Phoenix, AZ. Academically, Dr. Banerjee graduated from the Indian Institute of Technology, Bombay, India in 1992 with M.Tech. and Ph.D. in the area of Materials Science with a focus on Corrosion Engineering/ Electrochemistry. He later joined the University of Notre Dame as post doctoral research associate in 1993 and worked with Prof. A.E. Miller to demonstrate succesfully Quantum Confined Semiconducting and Superconducting structures using electrochemical techniques. In 2004, he was sponsored by Air Products to pursue the Executive MBA program at The Ohio State University, Columbus, OH. Dr. Banerjee has numerous publications and patents (issued and applied) to his credits. He has been invited to talk about his area of research at many international symposia/conferences in different countries. He is familiar with several European and Asian languages and cultures beside being multilingual within India. Apart from professional work, he divides his remaining time with his wife and two sons and volunteers for some charitable organizations.