Notre Dame Nanofabrication Facility
A 9,000-square-foot teaching and research cleanroom located in the Stinson-Remick Hall of Engineering, the Notre Dame Nanofabrication Facility (NDNF) provides a comprehensive suite of cutting-edge equipment for designing and fabricating integrated circuits and devices with feature sizes down to a few nanometers. Our researchers, which include internal and external academic researchers as well as corporate clients, explore a wide range of materials and processes — silicon-related electronic devices, compound semiconductor electronic and optoelectronic devices, nanowires and nanotubes across a range of material systems, 2-dimensional materials such as graphene and metal chalcogenides, organic polymer-based materials, and more. Researchers in the NDNF also explore microfluidic technologies for medical applications and micron-to-nanometer scale mechanical devices.
The NDNF consists of three large areas: an ISO 7 (class 10,000) area that houses CMP, wafer thinning, packaging and assembly, and molecular beam epitaxy; and ISO 5 and 6 (class 100 and 1000) areas that contain capabilities for metal deposition, lithography, oxidation, dielectric deposition, plasma processing, and wet-chemical processing. The major capabilities of the NDNF that are available to both academic (internal and external) and commercial users, include high resolution optical and electron-beam lithography, in-house mask making facilities, multiple systems for metal deposition (electron-beam evaporation, thermal evaporation, DC and RF sputtering, plasma-assisted atomic layer deposition), multiple systems for dielectric deposition (chemical vapor deposition, RF sputtering, evaporation, plasma-enhanced chemical vapor deposition, and atomic layer deposition), dry etching and plasma treatment (reactive ion etching and multiple systems for inductively-coupled reactive ion etching, including Bosch etching, parallel-plate and barrel plasma systems), thermal processing (oxidation and annealing furnaces, rapid thermal annealing), chemical-mechanical polishing, wafer thinning and polishing, assembly (die attach, wirebonding), and inspection and metrology (electron microscopy, optical microscopy, 3D laser confocal microscopy, profilometry, spectroscopic and single-wavelength ellipsometry, and electrical characterization).
For a list of the major equipment within NDNF, visit the Web site.